An anonymous reader quotes a report from The Wall Street Journal: Huawei’s latest phone, which it unveiled in September — the Mate 30 with a curved display and wide-angle cameras that competes with Apple’s iPhone 11 — contained no U.S. parts, according to an analysis by UBS and Fomalhaut Techno Solutions, a Japanese technology lab that took the device apart to inspect its insides. In May, the Trump administration banned U.S. shipments to Huawei as trade tensions with Beijing escalated. That move stopped companies like Qualcomm Inc. and Intel Corp. from exporting chips to the company, though some shipments of parts resumed over the summer after companies determined they weren’t affected by the ban. While Huawei hasn’t stopped using American chips entirely, it has reduced its reliance on U.S. suppliers or eliminated U.S. chips in phones launched since May (Warning: source paywalled; alternative source), including the company’s Y9 Prime and Mate smartphones, according to Fomalhaut’s teardown analysis. Similar inspections by iFixit and Tech Insights Inc., two other firms that take apart phones to inspect components, have come to similar conclusions. With the Mate 30, audio chips supplied in older versions came from Cirrus Logic. In the newer Mate 30 models, chips were provided by NXP Semiconductors NV, a Dutch chip maker, according to Fomalhaut. Power amplifiers provided by Qorvo or Skyworks were replaced with chips from HiSilicon, Huawei’s in-house chip design firm, the teardown analysis showed. A Huawei spokesman said it is the company’s “clear preference to continue to integrate and buy components from U.S. supply partners. If that proves impossible because of the decisions of the U.S. government, we will have no choice but to find alternative supply from non-U.S. sources.”

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